A robust metric for measuring within-wafer uniformity

Author

Davis, Joseph C. ; Gyurcsik, Ronald S. ; Lu, Jye-Chi ; Hughes-Oliver, Jacqueline ; Nychka, Douglas

Author_Institution

Dept. of Electr. & Comput. Eng., North Carolina State Univ., Raleigh, NC, USA

fYear

1995

fDate

2-4 Oct 1995

Firstpage

396

Lastpage

401

Abstract

A robust metric for measuring within-wafer uniformity has been developed and compared to the traditional SNR metric. The new statistic, referred to as the integration statistic, is based on the integration of the volumetric error between the target and the actual surfaces. Comparison with the traditional SNR uniformity metric indicates that the integration statistic provides a more consistent estimate of the uniformity for different numbers of measurements and different orientations of those measurements to the uniformity pattern

Keywords

integrated circuit manufacture; integrated circuit measurement; SNR metric; integration statistic; orientation; robust metric; semiconductor wafer processing; volumetric error; within-wafer uniformity measurement; Area measurement; Condition monitoring; Error analysis; Gaussian distribution; Materials processing; Measurement standards; Process design; Robustness; State estimation; Statistical distributions; Statistics;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Manufacturing Technology Symposium, 1995. 'Manufacturing Technologies - Present and Future', Seventeenth IEEE/CPMT International

Conference_Location

Austin, TX

Print_ISBN

0-7803-2996-1

Type

conf

DOI

10.1109/IEMT.1995.526193

Filename

526193