DocumentCode :
3471701
Title :
NBTI in dual gate oxide PMOSFETs
Author :
Chaparala, Prasad ; Brisbin, Douglas ; Shi, James
Author_Institution :
Adv. Process Technol. Dev., Nat. Semicond. Corp., Santa Clara, CA, USA
fYear :
2003
fDate :
24-25 April 2003
Firstpage :
138
Lastpage :
141
Abstract :
In advanced analog and mixed signal applications, Negative Bias Temperature Instability (NBTI) in dual gate oxide (DGO) technologies poses significant challenges for process development and robust analog circuit design. In this paper, Vt mismatch shift due to NBTI in a cascode current mirror is examined. The impact of stress time, temperature, gate voltage, drain voltage, and annealing on NBTI degradation is investigated over a wide range of stress conditions. Proper process trade-offs must be made to reduce NBTI degradation while integrating a DGO module into a high performance CMOS core process.
Keywords :
CMOS analogue integrated circuits; MOSFET; annealing; current mirrors; integrated circuit reliability; integrated circuit testing; 0.18 micron; 1000 hour; 85 to 150 C; DGO technologies; NBTI degradation; annealing; cascode current mirror; drain voltage; dual gate oxide PMOSFETs; gate voltage; high performance CMOS core process; negative bias temperature bistability; process development; process trade-offs; robust analog circuit design; stress time; threshold voltage mismatch shift; Analog circuits; Degradation; MOSFETs; Negative bias temperature instability; Niobium compounds; Robustness; Signal processing; Stress; Titanium compounds; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Plasma- and Process-Induced Damage, 2003 8th International Symposium
Print_ISBN :
0-7803-7747-8
Type :
conf
DOI :
10.1109/PPID.2003.1200942
Filename :
1200942
Link To Document :
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