DocumentCode
3471788
Title
LSM vision gage R&R study
Author
Messina, William S. ; Willey, Leslie G. ; Jones, Ken W.
Author_Institution
Huntsville Electron., Chrysler Corp., Huntsville, AL, USA
fYear
1995
fDate
2-4 Oct 1995
Firstpage
402
Lastpage
409
Abstract
The purpose of this study is to assess whether the laser scanning microscope (LSM) is capable of measuring solder paste height. The LSM projects a scanning laser beam onto the PC board which is deflected around the solder paste deposit. The height of the paste was determined by taking the difference between the highest (top) and lowest (bottom) laser deflection points on and surrounding the paste deposit respectively
Keywords
measurement by laser beam; optical microscopy; optical scanners; printed circuit testing; production testing; soldering; thickness measurement; LSM; PC board; laser deflection points; laser scanning microscope; scanning laser beam; solder paste height; vision gage; Analysis of variance; Data analysis; Design for experiments; Laser beams; Manufacturing; Microscopy; Performance analysis; Resists;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Manufacturing Technology Symposium, 1995. 'Manufacturing Technologies - Present and Future', Seventeenth IEEE/CPMT International
Conference_Location
Austin, TX
Print_ISBN
0-7803-2996-1
Type
conf
DOI
10.1109/IEMT.1995.526194
Filename
526194
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