Wafer dice process improvement using Six Sigma approach

Quality is an important objective in production or operational function. In mass production, a high accuracy manufacture line, better quality and less variance are inevitable. Six Sigma is customer oriented, improving the whole process by using data and statistical method for enhancing quality management. The main barrier in achieving targeted quality is product variation which causes by differences in machines, suppliers, raw materials and production batch. If the product variation is uncontrolled, the product needs to be reworked. Six Sigma approach focuses on quality improvement by eliminating variation in manufacturing process. In this paper, the use of quality techniques in Six Sigma methods for process improvement by electronic component manufacturing company is discussed. Six Sigma method by DMAIC approach is proposed to reduce defect rate of wafer dice processing. The optimum parameters were established through the design of experiment to ensure the process was stable.