DocumentCode
3472364
Title
Mounting technology of BGA-P and BGA-T
Author
Hattas, David ; Wakigawa, Asahiro
Author_Institution
Panasonic Factory Autom., Franklin Park, IL, USA
fYear
1995
fDate
2-4 Oct 1995
Firstpage
417
Lastpage
421
Abstract
The BGA is not as easy to inspect or repair as other package formats. The feasibility of its practical application hinges, therefore, on the condition that its bonding rate and solder defect level is superior to that of the QFP. In order to promote the spread of BGAs, there is a pressing need to establish a process for ensuring high bonding reliability. In this report, we present the mounting test on a BGA-P with 225 pins and a BGA-T with 426 pins. We hope that this information will contribute to spurring the adoption of the BGAs
Keywords
integrated circuit packaging; integrated circuit reliability; soldering; surface mount technology; BGA-P; BGA-T; IC packages; SMT; ball-grid arrays; bonding rate; bonding reliability; mounting technology; solder defect level; Bonding; Copper; Electronic equipment testing; Electronics packaging; Fasteners; Lead; Manufacturing; National electric code; Pins; Pressing; Resins; Temperature; Testing; Tin;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Manufacturing Technology Symposium, 1995. 'Manufacturing Technologies - Present and Future', Seventeenth IEEE/CPMT International
Conference_Location
Austin, TX
Print_ISBN
0-7803-2996-1
Type
conf
DOI
10.1109/IEMT.1995.526197
Filename
526197
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