Title :
Mounting technology of BGA-P and BGA-T
Author :
Hattas, David ; Wakigawa, Asahiro
Author_Institution :
Panasonic Factory Autom., Franklin Park, IL, USA
Abstract :
The BGA is not as easy to inspect or repair as other package formats. The feasibility of its practical application hinges, therefore, on the condition that its bonding rate and solder defect level is superior to that of the QFP. In order to promote the spread of BGAs, there is a pressing need to establish a process for ensuring high bonding reliability. In this report, we present the mounting test on a BGA-P with 225 pins and a BGA-T with 426 pins. We hope that this information will contribute to spurring the adoption of the BGAs
Keywords :
integrated circuit packaging; integrated circuit reliability; soldering; surface mount technology; BGA-P; BGA-T; IC packages; SMT; ball-grid arrays; bonding rate; bonding reliability; mounting technology; solder defect level; Bonding; Copper; Electronic equipment testing; Electronics packaging; Fasteners; Lead; Manufacturing; National electric code; Pins; Pressing; Resins; Temperature; Testing; Tin;
Conference_Titel :
Electronics Manufacturing Technology Symposium, 1995. 'Manufacturing Technologies - Present and Future', Seventeenth IEEE/CPMT International
Conference_Location :
Austin, TX
Print_ISBN :
0-7803-2996-1
DOI :
10.1109/IEMT.1995.526197
