• DocumentCode
    3473245
  • Title

    Temperature-aware global placement

  • Author

    Obermeier, Bernd ; Johannes, Frank M.

  • Author_Institution
    Inst. of Electron. Design Autom., Tech. Univ. of Munich, Germany
  • fYear
    2004
  • fDate
    27-30 Jan. 2004
  • Firstpage
    143
  • Lastpage
    148
  • Abstract
    We describe a deterministic placement method for standard cells which minimizes total power consumption and leads to a smooth temperature distribution over the die. It is based on the quadratic placement formulation, where the overall weighted net length is minimized. Two innovations are introduced to achieve the above goals. First, overall power consumption is minimized by shortening nets with a high power dissipation. Second, cells are spread over the placement area such that the die temperature profile inside the package is flattened. Experimental results show a significant reduction of the maximum temperature on the die and a reduction of total power consumption.
  • Keywords
    circuit layout CAD; power consumption; temperature distribution; deterministic placement method; power consumption; quadratic placement formulation; smooth temperature distribution; temperature-aware global placement; Capacitance; Circuits; Computational modeling; Electronic design automation and methodology; Energy consumption; Packaging; Power dissipation; Simulated annealing; Temperature distribution; Threshold voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design Automation Conference, 2004. Proceedings of the ASP-DAC 2004. Asia and South Pacific
  • Print_ISBN
    0-7803-8175-0
  • Type

    conf

  • DOI
    10.1109/ASPDAC.2004.1337555
  • Filename
    1337555