Electrical insulation properties of the polyimide prepared by VDPM

Author

Park, J.K. ; Kim, H.G. ; Kim, J.T. ; Lee, D.C.

Author_Institution

Dept. of Inf. & Commun., Yuhan Coll., Kyeongi-do, South Korea

fYear

1999

fDate

1999

Firstpage

281

Abstract

The polyimide thin films, which are synthesized with pyromellitic dianhydride (PMDA) and 4,4´-diaminodiphenyl ether (DDE), are fabricated by the vapor deposition polymerized method of dry processes. In order to analyze the characteristics required for inter-layer insulation films of semiconductor devices, the molecular structure and uniformity, the variation of the internal composition element, the permeation depth of the upper electrode, and the breakdown strength are experimentally investigated

Keywords

Auger electron spectra; dielectric thin films; electric strength; infrared spectra; integrated circuit metallisation; organic insulating materials; polymer films; polymer structure; polymerisation; vacuum deposition; 4,4´-diaminodiphenyl ether; breakdown strength; dry processes; electrical insulation properties; inter-layer insulation films; internal composition element variation; molecular structure; polyimide thin films; pyromellitic dianhydride; semiconductor devices; uniformity; upper electrode permeation depth; vapor deposition polymerized method; Chemical vapor deposition; Dielectrics and electrical insulation; Electric breakdown; Electrodes; Polyimides; Polymer films; Semiconductor devices; Semiconductor films; Semiconductor thin films; Sputtering;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Insulation and Dielectric Phenomena, 1999 Annual Report Conference on

Conference_Location

Austin, TX

Print_ISBN

0-7803-5414-1

Type

conf

DOI

10.1109/CEIDP.1999.804644

Filename

804644