DocumentCode
3474405
Title
Two-dimensional modeling of multifrequency composites
Author
Lamberti, N. ; De Espinosa, F. Montero ; Sánchez, S. ; Iula, A. ; Pappalardo, M.
Author_Institution
Dipartimento Ing. Informaz. de Ing. Elettrica, Salerno Univ., Italy
Volume
2
fYear
1995
fDate
7-10 Nov 1995
Firstpage
1033
Abstract
Multifrequency composites seems to be a good approach to increase the acoustic bandwidth of standard piezoelectric composites. The mechanical coupling between the different piezoceramic elements introduces new degrees of freedom into their design. One-dimensional models have been developed to study their performances in a first approximation. In order to obtain a powerful design model, a two-dimensional model used previously to describe multielement array transducers has been extended to the case of 2-2 polymer-piezoceramic composites. Several composite samples having piezoceramic strips of different width-to-thickness ratio have been built comparing their resonance behavior with the model prediction. Finally, the model has been modified to the case of 2-2 multifrequency composites. The comparison between the experimental results and the predicted ones in the case of composites with ceramic strips of two and three different lateral dimensions is presented, showing good agreement
Keywords
acoustic resonance; composite materials; piezoceramics; piezoelectric transducers; polymers; ultrasonic transducer arrays; 2-2 polymer-piezoceramic composites; acoustic bandwidth; degrees of freedom; design; lateral dimensions; mechanical coupling; multielement array transducers; multifrequency composites; one-dimensional models; piezoceramic elements; piezoceramic strips; resonance behavior; standard piezoelectric composites; two-dimensional model; width-to-thickness ratio; Bandwidth; Ceramics; Frequency conversion; Piezoelectric materials; Piezoelectric transducers; Polymers; Predictive models; Resonance; Resonant frequency; Strips;
fLanguage
English
Publisher
ieee
Conference_Titel
Ultrasonics Symposium, 1995. Proceedings., 1995 IEEE
Conference_Location
Seattle, WA
ISSN
1051-0117
Print_ISBN
0-7803-2940-6
Type
conf
DOI
10.1109/ULTSYM.1995.495739
Filename
495739
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