• DocumentCode
    3474465
  • Title

    The Failure Mechanism of Gate Resistance Testing for Power MOSFET

  • Author

    Pan, Shaohui ; He, Lunwen ; Zhang, David Wei ; Wang, LK

  • Author_Institution
    Dept. of Microelectron., Fudan Univ., Shanghai
  • fYear
    2006
  • fDate
    23-26 Oct. 2006
  • Firstpage
    2132
  • Lastpage
    2134
  • Abstract
    The vertical DMOS (double diffused MOSFET) is widely used in power microelectronics, its switching performance is determined mainly by the gate resistance and the input capacitance. Thus a gate resistance testing technique is developed in order to determine its device functionality. In this paper the authors discuss various processes induced device failures, such as the poor interconnect of the poly gate and the metal, the bonding wire, and the etch process, and their impact to the performance and reliability of the devices as well as the in-line testing method used for the performance validation
  • Keywords
    power MOSFET; semiconductor device reliability; semiconductor device testing; bonding wire; device failures; double diffused MOSFET; gate resistance testing; in-line testing; performance validation; power MOSFET; power microelectronics; Capacitance; Electric resistance; Failure analysis; Immune system; MOSFET circuits; Microelectronics; Power MOSFET; Power dissipation; Testing; Thermal resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State and Integrated Circuit Technology, 2006. ICSICT '06. 8th International Conference on
  • Conference_Location
    Shanghai
  • Print_ISBN
    1-4244-0160-7
  • Electronic_ISBN
    1-4244-0161-5
  • Type

    conf

  • DOI
    10.1109/ICSICT.2006.306638
  • Filename
    4098647