DocumentCode
3474465
Title
The Failure Mechanism of Gate Resistance Testing for Power MOSFET
Author
Pan, Shaohui ; He, Lunwen ; Zhang, David Wei ; Wang, LK
Author_Institution
Dept. of Microelectron., Fudan Univ., Shanghai
fYear
2006
fDate
23-26 Oct. 2006
Firstpage
2132
Lastpage
2134
Abstract
The vertical DMOS (double diffused MOSFET) is widely used in power microelectronics, its switching performance is determined mainly by the gate resistance and the input capacitance. Thus a gate resistance testing technique is developed in order to determine its device functionality. In this paper the authors discuss various processes induced device failures, such as the poor interconnect of the poly gate and the metal, the bonding wire, and the etch process, and their impact to the performance and reliability of the devices as well as the in-line testing method used for the performance validation
Keywords
power MOSFET; semiconductor device reliability; semiconductor device testing; bonding wire; device failures; double diffused MOSFET; gate resistance testing; in-line testing; performance validation; power MOSFET; power microelectronics; Capacitance; Electric resistance; Failure analysis; Immune system; MOSFET circuits; Microelectronics; Power MOSFET; Power dissipation; Testing; Thermal resistance;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State and Integrated Circuit Technology, 2006. ICSICT '06. 8th International Conference on
Conference_Location
Shanghai
Print_ISBN
1-4244-0160-7
Electronic_ISBN
1-4244-0161-5
Type
conf
DOI
10.1109/ICSICT.2006.306638
Filename
4098647
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