DocumentCode
3474492
Title
Ericsson´s VLSI mini-fab strategy; low volume VLSI fab to ensure short time to market for Ericsson telecom systems and products
Author
Engde, Kurt-Ingvar
Author_Institution
Ericsson Components AB, Stockholm, Sweden
fYear
1995
fDate
2-4 Oct 1995
Firstpage
482
Lastpage
485
Abstract
Ericsson adopted a rather different approach when it planned a submicron fab at its Kista site in Sweden. Wafer manufacturing volumes were less important than time factors, since the principal role of the fab is to reduce the design and manufacturing lead times for the complex ASICs needed in the company´s telecommunications products and systems. In this paper, the author describes Ericsson´s rather unusual strategy for microelectronics sourcing
Keywords
VLSI; application specific integrated circuits; integrated circuit manufacture; strategic planning; ASICs; Ericsson; Kista site; Sweden; VLSI; low volume fab; manufacturing lead times; microelectronics sourcing; mini-fab strategy; telecom systems; time factors; time to market; Application specific integrated circuits; Business; CMOS technology; Hardware; Lead time reduction; Manufacturing; Microelectronics; Printed circuits; Reactive power; Semiconductor device manufacture; Time factors; Time to market; Very large scale integration;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Manufacturing Technology Symposium, 1995. 'Manufacturing Technologies - Present and Future', Seventeenth IEEE/CPMT International
Conference_Location
Austin, TX
Print_ISBN
0-7803-2996-1
Type
conf
DOI
10.1109/IEMT.1995.526207
Filename
526207
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