fDate :
Oct. 16 2006-Sept. 19 2006
Abstract :
The following topics are dealt with: NBTI and hot carrier aging; MOSFETs; interconnect reliability; electromigration; passive component reliability for mixed signal; transistor reliability; memory reliability; product reliability; wafer level reliability; gate oxides; high-k dielectrics
Keywords :
MOSFET; electromigration; high-k dielectric thin films; hot carriers; integrated circuit interconnections; integrated circuit reliability; semiconductor device reliability; MOSFET; NBTI; electromigration; gate oxides; high-k dielectrics; hot carrier aging; interconnect reliability; memory reliability; passive component reliability; product reliability; transistor reliability; wafer level reliability;
Conference_Titel :
Integrated Reliability Workshop Final Report, 2006 IEEE International
Conference_Location :
South Lake Tahoe, CA
Print_ISBN :
1-4244-0296-4
DOI :
10.1109/IRWS.2006.305192
