Study of porous silicon substrate for the integration of radiofrequency monolithic circuits

The silicon/porous silicon hybrid substrate is an interesting candidate for the integration of radiofrequency circuits. Thus, passive components can be integrated on the insulating porous silicon regions closed to the active devices integrated on silicon. Regarding to silicon, the hybrid substrate allows the improvment of RF circuits performances. To demonstrate it, coplanar waveguides and inductors have been integrated on glass, silicon and localised porous silicon substrates. Characterisation results show that substrate losses are reduced with the porous silicon substrate.