DocumentCode
3475090
Title
On the impact of the NBTI recovery phenomenon on lifetime prediction of modern p-MOSFETs
Author
Schlunder, Christian ; Heinrigs, Wolfgang ; Gustin, Wolfgang ; Reisinger, Hans
Author_Institution
Dept. of Central Reliability, Infineon Technol. AG, Munich
fYear
2006
fDate
Oct. 16 2006-Sept. 19 2006
Firstpage
1
Lastpage
4
Abstract
The NBTI recovery phenomenon leads to a fast reduction of the stress induced electrical device parameter degradation after end of stress. Delay times between device-stress and -characterization within NBTI-experiments affect the measurement values of degradation. This work discusses the impact of these delays on lifetime prediction for technology qualifications. For this reason we investigate delay times from 1mus up to 60s and stress times from 100ms up to 250000s. A correlation between stress time, delay time induced recovery and error in predicted lifetime is elaborated for the first time. Furthermore we give simple guidelines for measurement requirements and essential stress times for accurate lifetime evaluations
Keywords
MOSFET; delay estimation; semiconductor device reliability; stress measurement; thermal stability; NBTI recovery phenomenon; delay times; lifetime prediction; modern p-MOSFET; stress induced electrical device parameter degradation; stress times; CMOS technology; Degradation; Delay effects; MOSFET circuits; Niobium compounds; Operational amplifiers; Performance evaluation; Stress measurement; Threshold voltage; Titanium compounds;
fLanguage
English
Publisher
ieee
Conference_Titel
Integrated Reliability Workshop Final Report, 2006 IEEE International
Conference_Location
South Lake Tahoe, CA
ISSN
1930-8841
Print_ISBN
1-4244-0296-4
Electronic_ISBN
1930-8841
Type
conf
DOI
10.1109/IRWS.2006.305199
Filename
4098676
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