• DocumentCode
    3475090
  • Title

    On the impact of the NBTI recovery phenomenon on lifetime prediction of modern p-MOSFETs

  • Author

    Schlunder, Christian ; Heinrigs, Wolfgang ; Gustin, Wolfgang ; Reisinger, Hans

  • Author_Institution
    Dept. of Central Reliability, Infineon Technol. AG, Munich
  • fYear
    2006
  • fDate
    Oct. 16 2006-Sept. 19 2006
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    The NBTI recovery phenomenon leads to a fast reduction of the stress induced electrical device parameter degradation after end of stress. Delay times between device-stress and -characterization within NBTI-experiments affect the measurement values of degradation. This work discusses the impact of these delays on lifetime prediction for technology qualifications. For this reason we investigate delay times from 1mus up to 60s and stress times from 100ms up to 250000s. A correlation between stress time, delay time induced recovery and error in predicted lifetime is elaborated for the first time. Furthermore we give simple guidelines for measurement requirements and essential stress times for accurate lifetime evaluations
  • Keywords
    MOSFET; delay estimation; semiconductor device reliability; stress measurement; thermal stability; NBTI recovery phenomenon; delay times; lifetime prediction; modern p-MOSFET; stress induced electrical device parameter degradation; stress times; CMOS technology; Degradation; Delay effects; MOSFET circuits; Niobium compounds; Operational amplifiers; Performance evaluation; Stress measurement; Threshold voltage; Titanium compounds;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Integrated Reliability Workshop Final Report, 2006 IEEE International
  • Conference_Location
    South Lake Tahoe, CA
  • ISSN
    1930-8841
  • Print_ISBN
    1-4244-0296-4
  • Electronic_ISBN
    1930-8841
  • Type

    conf

  • DOI
    10.1109/IRWS.2006.305199
  • Filename
    4098676