• DocumentCode
    3476042
  • Title

    Threshold voltage model for double gate p-IMOS

  • Author

    Heming Yao ; Foad, Saddam

  • Author_Institution
    Beihang Sino-French Eng. Sch., Beihang Univ., Beijing, China
  • fYear
    2013
  • fDate
    3-5 June 2013
  • Firstpage
    1
  • Lastpage
    2
  • Abstract
    IMOS device with the low static power consumption and the sub threshold swing is obviously superior to the traditional CMOS device. However, the single gate IMOS (SG IMOS) requires a relatively high gate voltage to cause the avalanche breakdown, and the partition structure of its channel leads to a reduction of the integration degree. This paper presents a double gate p-IMOS (DG p-IMOS). By solving the two-dimensional Possion equations and using the different regions of different electric field distribution and the avalanche breakdown condition, DG p-IMOS threshold voltage equation is obtained. By analyzing the model, the dependences of threshold voltage on drain-source voltage, Si layer thickness and gate length are studied. The model is compared with the SG p-IMOS to verify the advantages of DG p-IMOS. The results of the model are in good agreement with the 2D simulation results.
  • Keywords
    MOSFET; Poisson equation; avalanche breakdown; electric fields; elemental semiconductors; low-power electronics; semiconductor device models; silicon; DG p-IMOS threshold voltage equation; avalanche breakdown eondition; channel partition structure; double gate p-IMOS; drain-source voltage; electric field distribution; gate length; high gate voltage; integration degree reduction; low static power consumption; silicon layer thickness; sub-threshold swing; threshold voltage model; two-dimensional Possion equations; Lead; Logic gates; Silicon; DG p-IMOS; avalanche breakdown; threshold voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices and Solid-State Circuits (EDSSC), 2013 IEEE International Conference of
  • Conference_Location
    Hong Kong
  • Type

    conf

  • DOI
    10.1109/EDSSC.2013.6628110
  • Filename
    6628110