• DocumentCode
    3476329
  • Title

    More effective troubleshooting using data collection on etch equipment: case studies

  • Author

    Durham, Jim ; Felker, Steve ; Yoo, Bob ; Martinez, Jimmy ; Shelton, Steve

  • Author_Institution
    Motorola Inc., Mesa, AZ, USA
  • fYear
    1997
  • fDate
    9-12 Sep 1997
  • Firstpage
    528
  • Lastpage
    531
  • Abstract
    The complexity of etch equipment and etch processes drives the need for equally complex troubleshooting systems. Advanced data collection software allows the user to collect and store data from every wafer that is processed. The ability to retrieve the data and review either individual wafer information or data trends has become an effective tool for troubleshooting. Situations that are extremely difficult to troubleshoot without the ability to retrieve process data include intermittent equipment malfunctions, problems found during subsequent processing or inspections, and problems detected at probe. Data collection and archiving gives maintenance and engineering the opportunity to analyze the data long after the process is complete. Analysis of the data often leads to solutions that will prevent another occurrence. Case studies will be used to display the effective utilization of data collection for troubleshooting complex etch problems
  • Keywords
    data acquisition; etching; failure analysis; industrial control; integrated circuit manufacture; maintenance engineering; manufacturing data processing; production engineering computing; data archiving; data collection; etch equipment; intermittent equipment malfunctions; semiconductor wafer; Clamps; Computer aided software engineering; Cooling; Data analysis; Etching; Helium; Information retrieval; Inspection; Resists; Signal processing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Emerging Technologies and Factory Automation Proceedings, 1997. ETFA '97., 1997 6th International Conference on
  • Conference_Location
    Los Angeles, CA
  • Print_ISBN
    0-7803-4192-9
  • Type

    conf

  • DOI
    10.1109/ETFA.1997.616326
  • Filename
    616326