Title :
Calibration and characterization techniques for on-wafer device characterization
Author :
Galatro, L. ; Spirito, M.
Author_Institution :
Electron. Res. Lab., Delft Univ. of Technol., Delft, Netherlands
Abstract :
In this contribution we review the challenges and possible solutions to achieve accurate s-parameters and power calibration in the (sub)mm-wave bands. A numerical and experimental analysis of multimode propagation over co-planar transmission lines, used during the calibration process, is described. The losses and coupling effects arising from the unwanted propagating modes are analysed by means of 3D electro-magnetic simulations. Fused silica is then proposed as an optimal calibration substrate due to its low loss-tangent and low dielectric constant, which allows to reduce, compared to alumina, losses arising from spurious modes. Experimental data of probelevel calibration performed in the 220-325GHz band are presented. A frequency scalable approach to achieve absolute power control for large signal characterization in the (sub)mm-wave bands is introduced. The proposed hardware configuration employs only a commercially available VNA and the required frequency extenders to cover a given band and does not employ expensive additional test-sets. Measurement results are provided in WR-10, WR-05 and WR-03 waveguide bands to report the scalability of the method.
Keywords :
S-parameters; calibration; coplanar transmission lines; millimetre wave propagation; 3D electromagnetic simulations; WR-03 waveguide bands; WR-05 waveguide bands; WR-10 waveguide bands; absolute power control; calibration process; co-planar transmission lines; commercially available VNA; coupling effects; frequency 220 GHz to 325 GHz; frequency extenders; fused silica; large signal characterization; multimode propagation; optimal calibration substrate; power calibration; probe-level calibration; s-parameters; spurious modes; submm-wave bands; unwanted propagating modes; Calibration; Coplanar waveguides; Frequency measurement; Power measurement; Silicon compounds; Substrates; Three-dimensional displays; (sub)mm-wave; Surface waves; dispersion; multimode propagation; on-wafer calibration;
Conference_Titel :
New Circuits and Systems Conference (NEWCAS), 2015 IEEE 13th International
Conference_Location :
Grenoble
DOI :
10.1109/NEWCAS.2015.7181978