DocumentCode
3476822
Title
Fabrication and analysis of 2D embedded passive devices in PCB
Author
Jing Zhang ; Baoxia Li ; Lixi Wan ; Daniel, Grivon ; Liqiang Cao ; Zhiyong Cui ; Tianmin Du ; Hu Hao
Author_Institution
Inst. of Microelectron., Beijing, China
fYear
2013
fDate
11-14 Aug. 2013
Firstpage
100
Lastpage
104
Abstract
This paper presents fabrication and electrical characterization of embedded passives in organic multilayered substrates. We have designed and fabricated a test board and a functional application focusing on embedded passives. A test board with two embedded capacitor layers and one embedded resistor layer was used to evaluate capacitance and resistance performance. The functional application was used to evaluate the performance of integrated passive devices (capacitors, resistors and inductors).
Keywords
buried layers; capacitors; inductors; printed circuit manufacture; resistors; 2D embedded passive device; PCB; capacitance performance; electrical characterization; embedded capacitor layer; embedded passives; embedded resistor layer; inductor; integrated passive device; organic multilayered substrate; resistance performance; Capacitance; Capacitors; Inductors; Resistance; Resistors; Substrates; Embedded Passive Device; Filter; Noise isolation;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology (ICEPT), 2013 14th International Conference on
Conference_Location
Dalian
Type
conf
DOI
10.1109/ICEPT.2013.6756432
Filename
6756432
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