DocumentCode :
3476822
Title :
Fabrication and analysis of 2D embedded passive devices in PCB
Author :
Jing Zhang ; Baoxia Li ; Lixi Wan ; Daniel, Grivon ; Liqiang Cao ; Zhiyong Cui ; Tianmin Du ; Hu Hao
Author_Institution :
Inst. of Microelectron., Beijing, China
fYear :
2013
fDate :
11-14 Aug. 2013
Firstpage :
100
Lastpage :
104
Abstract :
This paper presents fabrication and electrical characterization of embedded passives in organic multilayered substrates. We have designed and fabricated a test board and a functional application focusing on embedded passives. A test board with two embedded capacitor layers and one embedded resistor layer was used to evaluate capacitance and resistance performance. The functional application was used to evaluate the performance of integrated passive devices (capacitors, resistors and inductors).
Keywords :
buried layers; capacitors; inductors; printed circuit manufacture; resistors; 2D embedded passive device; PCB; capacitance performance; electrical characterization; embedded capacitor layer; embedded passives; embedded resistor layer; inductor; integrated passive device; organic multilayered substrate; resistance performance; Capacitance; Capacitors; Inductors; Resistance; Resistors; Substrates; Embedded Passive Device; Filter; Noise isolation;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Packaging Technology (ICEPT), 2013 14th International Conference on
Conference_Location :
Dalian
Type :
conf
DOI :
10.1109/ICEPT.2013.6756432
Filename :
6756432
Link To Document :
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