Title :
TLP and HBM ESD test correlation for power ICs
Author :
Rui Ma ; Li Wang ; Chen Zhang ; Fei Lu ; Zongyu Dong ; Wang, Aiping ; Wei Lu ; Yonghua Song ; Bin Zhao
Author_Institution :
Dept. of Electr. Eng., Univ. of California, Riverside, Riverside, CA, USA
Abstract :
This paper discusses a practical technique to accurately correlate package level ESD protection results by HBM (human body model) zapping and TLP (transmission line pulsing) testing. It is found that the ESD pulse duration plays a key role in correlating HBM and TLP testing results as verified by evaluating 40V-5V DC-DC convertor ICs.
Keywords :
DC-DC power convertors; electrostatic discharge; integrated circuit testing; power integrated circuits; transmission lines; DC-DC convertor IC; ESD pulse duration; HBM ESD test correlation; HBM zapping; TLP testing; human body model zapping; package level ESD protection; power IC; transmission line pulsing testing; voltage 40 V to 5 V; Electrostatic discharges; Light emitting diodes; Switches; ESD; HBM; TLP; power IC;
Conference_Titel :
Electron Devices and Solid-State Circuits (EDSSC), 2013 IEEE International Conference of
Conference_Location :
Hong Kong
DOI :
10.1109/EDSSC.2013.6628149
