Effect of reflow conditions on the die shear strength in flip chip on board with SAC305 solder joints

Author

Zhou Liangjie ; Huang Lin ; Wu Fengshun ; Liu Hui ; Xia Weisheng ; Fu Hongzhi ; Wang Shiyu ; Liu Zhe

Author_Institution

Sch. of Mater. Sci. & Eng., Huazhong Univ. of Sci. & Technol., Wuhan, China

fYear

2013

fDate

11-14 Aug. 2013

Firstpage

109

Lastpage

113

Abstract

Solder bump joint has been accepted as a main FCOB interconnection method so far. To optimize the process conditions for achieving SAC305 solder bumped FCOB assembly with maximum die shear strength and allowable void rate, an orthogonal experimental design of four factors and three levels was carried out. The optimal process conditions are: 100 seconds for preheating time, 245 °C for peak temperature, 60 seconds for time above liquidus, flux paste as the auxiliary material. Three fracture modes were observed and categorized for samples after shear test based on the fracture interface location. The most frequently occurring fracture mode is the ductile.

Keywords

copper alloys; flip-chip devices; integrated circuit interconnections; reflow soldering; shear strength; silver alloys; solders; tin alloys; voids (solid); FCOB interconnection method; SAC305 solder joints; SnAgCu; achieving SAC305 solder bumped FCOB assembly; auxiliary material; flip chip on board; flux paste; fracture interface location; fracture modes; maximum die shear strength; optimal process conditions; orthogonal experimental design; reflow condition effect; shear test; solder bump joint; temperature 245 degC; time 100 s; time 60 s; void rate; Electronics packaging; Flip-chip devices; Force; Soldering; Substrates; flip chip on board; lead-free reflow; orthogonal experimental design; shear strength;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology (ICEPT), 2013 14th International Conference on

Conference_Location

Dalian

Type

conf

DOI

10.1109/ICEPT.2013.6756434

Filename

6756434