Influence of package failure on IC´s reliability

Author

Lin Xiao-ling ; Lian Jian-wen ; Zhu Liang-biao

Author_Institution

Sci. & Technol. on Reliability Phys. & Applic. of Electr. Component Lab., China Electron. Product Reliability & Environ. Testing Res. Inst., Guangzhou, China

fYear

2013

fDate

11-14 Aug. 2013

Firstpage

114

Lastpage

117

Abstract

Different packaging materials and packaging forms have different influence on the reliability of devices. For the semiconductor device, failure mode caused by wire bond is up to nearly 49%. Therefore, understanding of the structure characteristics of various packaging and their main failure modes and mechanism has important meaning to improve the reliability of devices being used. In this paper, three kinds of common failure modes and failure mechanism of packaged devices are analyzed. Also, some precautions for reducing such failures are presented.

Keywords

failure analysis; integrated circuit packaging; integrated circuit reliability; lead bonding; IC reliability; failure mode; package failure; packaging forms; packaging materials; semiconductor device; wire bond; Compounds; Delamination; Gold; Plastics; Reliability; Stress; coefficient thermal expansion (CTE); delamination; failure analysis; plastic encapsulated microcircuits (PEMs); reliability;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology (ICEPT), 2013 14th International Conference on

Conference_Location

Dalian

Type

conf

DOI

10.1109/ICEPT.2013.6756435

Filename

6756435