DocumentCode
3477008
Title
Substrate with Ni/Au microcones surface for wire bonding
Author
Shixin Gao ; Anmin Hu ; Ming Li ; Kaiyou Qian ; Chiu, Huang-Jen
Author_Institution
Sch. of Mater. Sci. & Eng., Shanghai Jiao Tong Univ., Shanghai, China
fYear
2013
fDate
11-14 Aug. 2013
Firstpage
135
Lastpage
138
Abstract
Ni/Au microcones were fabricated and thermosonic bonded with Au wire. The thickness of Au film was only 0.05μm. The substrate with Ni/Au microcones showed good Au wire bondability with the average pull strength 4.85 gf and ball shear strength 54.33 gf. Microscopi observation showed that Ni/Au microcones were inserted into Au wire, thus physical interlock between the substrate and Au wire was formed. High temperature storage showed a perfect reliability.
Keywords
aluminium alloys; lead bonding; nickel alloys; reliability; shear strength; Ni-Au; average pull strength; ball shear strength; high temperature storage; microcones surface; microscope observation; perfect reliability; size 0.05 mum; thermosonic bonding; wire bonding; Bonding; Films; Gold; Nickel; Reliability; Substrates; Wires; ball bond; microcones; reliability; substrate surface; wire bonding;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology (ICEPT), 2013 14th International Conference on
Conference_Location
Dalian
Type
conf
DOI
10.1109/ICEPT.2013.6756440
Filename
6756440
Link To Document