Title :
A new packaging technique for power multichip modules
Author :
Gillot, C. ; Henry, D. ; Schaeffer, C. ; Massit, C.
Author_Institution :
Lab. d´´Electrotech. de Grenoble, CNRS, St. Martin d´´Heres, France
Abstract :
A new packaging technique for power multichip modules has been developed. The components are sandwiched between two DBC (direct bond copper) substrates with aluminum nitride. This innovative technique allows to replace wire bond with flip chip and to cool the module on both sides. Thus, electrical, thermal and reliability performance can be improved
Keywords :
cooling; integrated circuit packaging; integrated circuit reliability; multichip modules; power integrated circuits; substrates; AlN; direct bond copper substrates; electrical performance; flip chip; module cooling; packaging technique; power multichip modules; reliability performance; thermal performance; Bonding; Copper; Heat sinks; Heat transfer; Multichip modules; Packaging; Substrates; Thermal conductivity; Thermal resistance; Wire;
Conference_Titel :
Industry Applications Conference, 1999. Thirty-Fourth IAS Annual Meeting. Conference Record of the 1999 IEEE
Conference_Location :
Phoenix, AZ
Print_ISBN :
0-7803-5589-X
DOI :
10.1109/IAS.1999.805978
