Development of Sn-Bi systems lead-free solder paste

Author

Kangning Li ; Yongping Lei ; Jian Lin ; Baoquan Liu ; Hailong Bai ; Junhu Qin

Author_Institution

Coll. of Mater. Sci. & Eng., Beijing Univ. of Technol., Beijing, China

fYear

2013

fDate

11-14 Aug. 2013

Firstpage

160

Lastpage

162

Abstract

The contents of solvent, rosin and activator were adjusted to obtain the most appropriate proportion of the flux for Sn-Bi based lead free solder material by a series of orthogonal experiments. Compared with some commercial Sn-Bi based solder pastes, some tests about the solder paste, such as solder ball test, wettability test and slump test had been carried on. It was found that the self-made Sn-Bi based solder paste had an excellent performance. The welding spots had good appearance; the residues solidified well. The effect of the solder powder ratio on rheological and printing behavior had been studied. When the mass ratio was 12:88 wt%, the best rheological and printing properties of solder paste could be obtained.

Keywords

bismuth; solders; tin; Sn-Bi; activator; lead free solder material; mass ratio; orthogonal experiments; printing behavior; rheological behavior; rosin; self-made based solder paste; slump test; solder ball test; solder powder ratio; solvent; wettability test; Lead; Powders; Printing; Surface treatment; Viscosity; flux; lead-free solder paste; low temperature; wettability;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology (ICEPT), 2013 14th International Conference on

Conference_Location

Dalian

Type

conf

DOI

10.1109/ICEPT.2013.6756446

Filename

6756446