Title :
Ultra-thin chips for flexible electronics
Author :
Burghartz, Joachim N. ; Angelopoulos, E. ; Appel, W. ; Endler, S. ; Ferwana, S. ; Harendt, Christine ; Hassan, M.-U. ; Rempp, Horst ; Richter, H. ; Zimmermann, M.
Author_Institution :
Inst. for Microelectron. Stuttgart (IMS CHIPS), Stuttgart, Germany
Abstract :
Various aspects of ultra-thin chip technology for flexible electronics based on Chipfilm™ technology are presented and discussed, including ultra-thin-chip fabrication, mechanical and electrical characterization, as well as chip assembly and imbedding.
Keywords :
flexible electronics; system-on-chip; ChipfilmTM technology; chip assembly; chip imbedding; electrical characterization; flexible electronics; mechanical characterization; process technology; ultra-thin chip technology; ultra-thin-chip fabrication; chip stacking; mechanical stability; piezoresistive effect; process window; thin chips; thin-chip fabrication; warpage;
Conference_Titel :
Electron Devices and Solid-State Circuits (EDSSC), 2013 IEEE International Conference of
Conference_Location :
Hong Kong
DOI :
10.1109/EDSSC.2013.6628168
