Title :
Improvement of microstructure and mechanical properties of Sn-58Bi alloy with La2O3
Author :
Lijiao Gao ; Jun Wang ; Tiesong Lin ; Peng He ; Fengjiao Lu
Author_Institution :
State Key Lab. of Adv. Welding & Joining, Harbin Inst. of Technol., Harbin, China
Abstract :
Sn-58Bi alloy particles and La2O3 were mechanically mixed and melted to prepare the composite solder. The microstructures of the solder and the IMC grain sizes were analyzed. Morphology results showed that the adding of La2O3 could restrain the segregation of Bi-rich phases and reduce the brittleness of the solder alloy. The hardness of solder increased with the addition of La2O3, which were tested by nano-indentation.
Keywords :
bismuth alloys; composite materials; lanthanum alloys; nanoindentation; shear strength; solders; tin alloys; IMC grain sizes; La2O3; SnBi; alloy particles; composite solder; mechanical properties; microstructure properties; nanoindentation; solder alloy; Grain size; Lead; Mechanical factors; Microstructure; Morphology; La2O3; Sn-58Bi; microstructure; shear strength;
Conference_Titel :
Electronic Packaging Technology (ICEPT), 2013 14th International Conference on
Conference_Location :
Dalian
DOI :
10.1109/ICEPT.2013.6756451
