• DocumentCode
    3477293
  • Title

    Synthesis of tertiary ester epoxy resin and application in reworkable underfill

  • Author

    Lai Maobai ; Zhang Guoping ; Sun Rong

  • Author_Institution
    Res. Center for Adv. Mater., Shenzhen Inst. of Adv. Technol., Shenzhen, China
  • fYear
    2013
  • fDate
    11-14 Aug. 2013
  • Firstpage
    196
  • Lastpage
    199
  • Abstract
    In order to endue the underfill with reworkability, tertiary ester epoxy resin (TEER), bis[1-methyl-1-(6-methyl-7-oxa-bicyclo[4.1.0]hept-3-yl)-ethyl] isophthalate, was synthesized by the reactions of esterification and epoxidation. The structure was characterized by Fourier transform infrared With TEER as matrix, silica particles as filler, methyl hexahydro-phthalic anhydride (MeHHPA) as curing reagent and 2-Ethyl-4-methylimidazole (4E2MI) as accelerant, the underfill was successfully prepared. The ester group in the backbone would be pyrolyzed when it was heated. The sharp peak of pyrolysis curve by differential scanning calorimeter indicates the pyrolysis process has less side reaction and the pyrolysis range is around 220 °C. The pyrolysis is a carbenium intermediate process which relates to the stability of the carbenium. Tertiary carbenium is more stable which makes TEER have a lower pyrolysis temperature. Processing characteristics measurement results show that the reworkable underfill exhibits excellent processing performances and the tertiary ester epoxy resin is suitable for reworkable underfill.
  • Keywords
    Fourier transform spectroscopy; curing; differential scanning calorimetry; filled polymers; infrared spectroscopy; plastic packaging; pyrolysis; resins; silicon compounds; 2-ethyl-4-methylimidazole; Fourier transform infrared spectroscopy; SiO2; TEER; bis[1-methyl-1-(6-methyl-7-oxa-bicyclo[4.1.0]hept-3-yl)-ethyl] isophthalate; carbenium intermediate process; curing reagent; differential scanning calorimeter; epoxidation reaction; esterification reaction; methyl hexahydro-phthalic anhydride; pyrolysis curve; pyrolysis process; reworkable underfill; silica particles; tertiary carbenium; tertiary ester epoxy resin synthesis; Curing; Electronics packaging; Epoxy resins; Flip-chip devices; Heating; Polymers; pyrolysis temperature; reworkable underfill; tertiary ester epoxy resin;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology (ICEPT), 2013 14th International Conference on
  • Conference_Location
    Dalian
  • Type

    conf

  • DOI
    10.1109/ICEPT.2013.6756452
  • Filename
    6756452