Research on 0.6 mil Ag-8Au-3Pd alloy wire bonding process

Author

Cheng Yin ; Rui Guo ; Ming Li ; Xiao, Jun ; Lv, Eric ; Chiu, Huang-Jen

Author_Institution

Sch. of Mater. Sci. & Eng., Shanghai Jiao Tong Univ., Shanghai, China

fYear

2013

fDate

11-14 Aug. 2013

Firstpage

200

Lastpage

204

Abstract

Ag-8Au-3Pd alloy wire has shown its advantages as a kind of interconnect material in semiconductor packaging. In thermosonic wire bonding, a uniformed and stable Free-Air-Ball (FAB) created by electronic flame-off (EFO) is crucial to a reliable 1st bond. In this study, the relationship between Free-Air-Ball (FAB) size and EFO parameters (EFO current, EFO time) of 0.6 mil Ag-8Au-3Pd alloy wire has been investigated. According to the FAB formation curve of 0.6 mil Ag-8Au-3Pd alloy wire, a suitable EFO parameter was settled down, then a design of experiment (DOE) was set up to investigate the optimum parameter window. As expected, the experiment results illustrate that 0.6 mil Ag-8Au-3Pd alloy wire is workable as the interconnect material with less cost.

Keywords

electronics packaging; gold alloys; interconnections; lead bonding; palladium alloys; silver alloys; solders; Ag-Au-Pd; DOE; EFO; FAB size; design of experiment; electronic flame-off; free-air-ball; interconnect material; optimum parameter window; semiconductor packaging; size 0.6 mil; thermosonic wire bonding process; wire bonding process; Bonding; Copper; Gold; Materials; Packaging; Wires; Ag-8Au-3Pd; Free-Air-Ball; Process window; Wire bonding;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology (ICEPT), 2013 14th International Conference on

Conference_Location

Dalian

Type

conf

DOI

10.1109/ICEPT.2013.6756453

Filename

6756453