Title :
Research on 0.6 mil Ag-8Au-3Pd alloy wire bonding process
Author :
Cheng Yin ; Rui Guo ; Ming Li ; Xiao, Jun ; Lv, Eric ; Chiu, Huang-Jen
Author_Institution :
Sch. of Mater. Sci. & Eng., Shanghai Jiao Tong Univ., Shanghai, China
Abstract :
Ag-8Au-3Pd alloy wire has shown its advantages as a kind of interconnect material in semiconductor packaging. In thermosonic wire bonding, a uniformed and stable Free-Air-Ball (FAB) created by electronic flame-off (EFO) is crucial to a reliable 1st bond. In this study, the relationship between Free-Air-Ball (FAB) size and EFO parameters (EFO current, EFO time) of 0.6 mil Ag-8Au-3Pd alloy wire has been investigated. According to the FAB formation curve of 0.6 mil Ag-8Au-3Pd alloy wire, a suitable EFO parameter was settled down, then a design of experiment (DOE) was set up to investigate the optimum parameter window. As expected, the experiment results illustrate that 0.6 mil Ag-8Au-3Pd alloy wire is workable as the interconnect material with less cost.
Keywords :
electronics packaging; gold alloys; interconnections; lead bonding; palladium alloys; silver alloys; solders; Ag-Au-Pd; DOE; EFO; FAB size; design of experiment; electronic flame-off; free-air-ball; interconnect material; optimum parameter window; semiconductor packaging; size 0.6 mil; thermosonic wire bonding process; wire bonding process; Bonding; Copper; Gold; Materials; Packaging; Wires; Ag-8Au-3Pd; Free-Air-Ball; Process window; Wire bonding;
Conference_Titel :
Electronic Packaging Technology (ICEPT), 2013 14th International Conference on
Conference_Location :
Dalian
DOI :
10.1109/ICEPT.2013.6756453
