DocumentCode
3477322
Title
The optimization of Au wire bonding process in microwave modules
Author
Han Zongjie ; Yan Wei ; Jiang Weizhuo ; Hao Xinfeng
Author_Institution
Nanjing Res. Inst. of Electron. Technol., Nanjing, China
fYear
2013
fDate
11-14 Aug. 2013
Firstpage
205
Lastpage
208
Abstract
Au wire bonding technology used in microwave modules was studied in wedge bonding way in this paper, the optimal process parameters of wire bonding technology were obtained by using Taguchi method to improve the wire bonding reliability. The results indicate that the factors influencing wire bonding are US power, bonding force and bonding time in turn, and the optimal process parameters are US power about 15, bonding force about 16 and bonding time about 50; bonded Au wires with good stability are obtained, which can meet the needs of Au wire bonding used in microwave module.
Keywords
gold; lead bonding; microwave integrated circuits; Au; Taguchi method; US power; bonding force; bonding time; microwave modules; wedge bonding; wire bonding process; wire bonding reliability; wire bonding technology; Bonding; Bonding forces; Gold; Microwave communication; Wires; Au wire bonding; microwave module; parameter optimization;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology (ICEPT), 2013 14th International Conference on
Conference_Location
Dalian
Type
conf
DOI
10.1109/ICEPT.2013.6756454
Filename
6756454
Link To Document