Title :
The optimization of Au wire bonding process in microwave modules
Author :
Han Zongjie ; Yan Wei ; Jiang Weizhuo ; Hao Xinfeng
Author_Institution :
Nanjing Res. Inst. of Electron. Technol., Nanjing, China
Abstract :
Au wire bonding technology used in microwave modules was studied in wedge bonding way in this paper, the optimal process parameters of wire bonding technology were obtained by using Taguchi method to improve the wire bonding reliability. The results indicate that the factors influencing wire bonding are US power, bonding force and bonding time in turn, and the optimal process parameters are US power about 15, bonding force about 16 and bonding time about 50; bonded Au wires with good stability are obtained, which can meet the needs of Au wire bonding used in microwave module.
Keywords :
gold; lead bonding; microwave integrated circuits; Au; Taguchi method; US power; bonding force; bonding time; microwave modules; wedge bonding; wire bonding process; wire bonding reliability; wire bonding technology; Bonding; Bonding forces; Gold; Microwave communication; Wires; Au wire bonding; microwave module; parameter optimization;
Conference_Titel :
Electronic Packaging Technology (ICEPT), 2013 14th International Conference on
Conference_Location :
Dalian
DOI :
10.1109/ICEPT.2013.6756454
