DocumentCode
3477449
Title
Effect of chemical functionalization of multi-walled carbon nanotubes with 4´-Allyloxy-biphenyl-4-ol on thermal and mechanical properties of organosilicon nanocomposites
Author
Xue Gao ; Dayong Gui ; Jianhong Liu
Author_Institution
Sch. of Chem. & Chem. Eng., Shenzhen Univ., Shenzhen, China
fYear
2013
fDate
11-14 Aug. 2013
Firstpage
229
Lastpage
233
Abstract
In order to improve mechanical and thermal properties of electronic packaging materials, 4´-Allyloxy-biphenyl-4-ol (AOBPO) functionalized multi-walled carbon nanotube (A-MWCNTs) was used as fillers to mix with silicon resin to fabricate nanocomposites. The AOBPO greatly improved the dispersion of pristine MWCNTs in silicon resin by the π - π interactions. The microstructure of the composite was examined by scanning electron microscopy. The mechanical and thermal properties of the composite were characterized by tensile testing and thermogravimetric analysis. The study on the structure of the composite shows that carbon nanotubes can be dispersed in the polymer matrix well apart from a few of clusters. The results from thermal analysis indicate that the thermal stability of the composites can be obviously improved, in comparison with pure silicon resin. The investigation on the mechanical properties shows that the modulus and tensile strength can be obviously increased by adding A-MWCNTs (0.1wt% CNT/0.1wt% AOBPO) to the matrix.
Keywords
carbon nanotubes; electronics packaging; nanocomposites; resins; scanning electron microscopy; silicon; tensile strength; tensile testing; thermal analysis; thermal stability; 4´-Allyloxy-biphenyl-4-ol; Si; chemical functionalization effect; composite microstructure; electronic packaging material; mechanical property; modulus strength; multiwalled carbon nanotubes; organosilicon nanocomposites; polymer matrix; pristine MWCNT; scanning electron microscopy; silicon resin; tensile strength; tensile testing; thermal analysis; thermal property; thermal stability; thermogravimetric analysis; Carbon nanotubes; Conductivity; Mechanical factors; Nanocomposites; Resins; Silicon; Thermal stability; MWCNTs; electronic packaging; mechanical property; nanocomposites; thermal property;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology (ICEPT), 2013 14th International Conference on
Conference_Location
Dalian
Type
conf
DOI
10.1109/ICEPT.2013.6756460
Filename
6756460
Link To Document