• DocumentCode
    3477642
  • Title

    Power-Aware Wrappers for Transaction-Level Virtual Prototypes: A Black Box Based Approach

  • Author

    Mbarek, Ons ; Pegatoquet, Alain ; Auguin, Michel ; Fathallah, H.E.

  • Author_Institution
    LEAT, Univ. of Nice Sophia Antipolis, Sophia Antipolis, France
  • fYear
    2013
  • fDate
    5-10 Jan. 2013
  • Firstpage
    239
  • Lastpage
    244
  • Abstract
    Low power design and verification at the Electronic System Level (ESL) have recently emerged as a challenging research field. This work presents a reliable solution to add such capabilities to Transaction-Level virtual prototypes composed of black-box hardware Intellectual Properties (IPs). This solution relies on a wrapper-based approach in which power intent specification and verification are added as separate layers of the IPs functional ones. Using Synopsys´s InnovatorTM virtual prototyping toolset, our approach has been validated with an audio application TL platform. Results show our approach benefits to enable different power intent alternatives exploration with low simulation speed overhead and reduced modeling effort.
  • Keywords
    electronics industry; industrial property; low-power electronics; virtual prototyping; Synopsys Innovator virtual prototyping toolset; black-box hardware intellectual properties; electronic system level; power intent specification; power intent verification; power-aware wrappers; transaction-level virtual prototypes; Contracts; IP networks; Phasor measurement units; Prototypes; Registers; Standards; Virtual prototyping; Design-by-Contract (DbC); Intellectual Properties (IPs); Power Domain (PD); System-on-Chip (SoC); Transaction Level Models (TLM); Unified Power Format (UPF) standard; low power design and verification; power intent; virtual prototyping (VP);
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI Design and 2013 12th International Conference on Embedded Systems (VLSID), 2013 26th International Conference on
  • Conference_Location
    Pune
  • ISSN
    1063-9667
  • Print_ISBN
    978-1-4673-4639-9
  • Type

    conf

  • DOI
    10.1109/VLSID.2013.194
  • Filename
    6472646