DocumentCode
3477692
Title
Current and emerging production applications/trends of MeV technology
Author
Borland, John O.
Author_Institution
Ion Technol. Div., Genus Inc., Newburyport, MA, USA
fYear
1996
fDate
16-21 Jun 1996
Firstpage
17
Lastpage
20
Abstract
Current production applications of MeV implantation will be reviewed focusing on CMOS memory (DRAM, SRAM and Flash) and CMOS logic (ASIC and Microprocessor) device manufacturing. Also, the motivation from a manufacturing point of view will be presented for MeV twin and triple well formation including process simplification, cost reduction and improved productivity/capacity and profits. Replacement of traditional medium current implanters will also be discussed along with emerging and future production applications/trends
Keywords
CMOS integrated circuits; ion implantation; technological forecasting; ASIC; CMOS logic; CMOS memory; DRAM; Flash memory; MeV ion implantation technology; Microprocessor; SRAM; device manufacturing; high energy implanter; productivity; triple well; twin well; Application specific integrated circuits; Boron; CMOS logic circuits; CMOS technology; Costs; Implants; Logic devices; Manufacturing; Production; Random access memory;
fLanguage
English
Publisher
ieee
Conference_Titel
Ion Implantation Technology. Proceedings of the 11th International Conference on
Conference_Location
Austin, TX
Print_ISBN
0-7803-3289-X
Type
conf
DOI
10.1109/IIT.1996.586101
Filename
586101
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