Title :
Ag modified carbon nanotubes as filler for thermal interface materials
Author :
Zhi Zhang ; Xiaoliang Zeng ; Ling Zhang ; Pengli Zhu ; Kai Zhang ; Xianzhu Fu ; Rong Sun ; Yuen, M.M.F. ; Wong, C.P.
Author_Institution :
Shenzhen Inst. of Adv. Technol., Shenzhen, China
Abstract :
Ag surface modified carbon nanotubes (CNT) were prepared by electro-less plating method. The thermal interface materials (TIM) were obtained by mixed epoxy and nanotubes. The conductivity of expoxy-Ag coated CNT was much higher than that of epoxy-CNT. The Ag modified CNT is a promising high thermal conductive filler for polymer-based TIM.
Keywords :
carbon nanotubes; electronics packaging; electroplating; silver; Ag; C; electro-less plating method; high thermal conductive filler; mixed epoxy; surface modified carbon nanotubes; thermal interface materials; Carbon nanotubes; Conductivity; Electronic packaging thermal management; Polymers; Surface treatment; Thermal conductivity; carbon nanotube; electroless plating; filler; silver; thermal interface materials;
Conference_Titel :
Electronic Packaging Technology (ICEPT), 2013 14th International Conference on
Conference_Location :
Dalian
DOI :
10.1109/ICEPT.2013.6756476
