DocumentCode
3477816
Title
GeO2 /PZT resistive random access memory devices with Ni electrode
Author
Kun-I Chou ; Chun-Hu Cheng ; Chin, Alvin
Author_Institution
Dept. of Electron. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
fYear
2013
fDate
3-5 June 2013
Firstpage
1
Lastpage
2
Abstract
We report a resistive random-access memory (RRAM) using stacked GeO2 and PZT. Under unipolar mode operation, the Ni/GeO2/PZT/TaN RRAM shows a good DC cycling of 2×103 cycles, 85°C retention, and large resistance window about 120x, which is better than that shown by the single-layer Ni/PZT/TaN RRAM without the covalent-bond-dielectric GeO2.
Keywords
lead compounds; nickel; oxygen compounds; random-access storage; tantalum compounds; titanium compounds; zirconium compounds; DC cycling; Ni-GeO2-PZT-TaN; RRAM; resistance window; resistive random access memory devices; temperature 85 degC; unipolar mode operation; Dielectrics; Educational institutions; Electrodes; Nickel; Resistance; Silicon; Switches; GeO2 ; PZT; RRAM; TiO2 ;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices and Solid-State Circuits (EDSSC), 2013 IEEE International Conference of
Conference_Location
Hong Kong
Type
conf
DOI
10.1109/EDSSC.2013.6628194
Filename
6628194
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