Fabrication of monolithic integrated MEMS resonator with wet-release-monitoring array

Author

Danqi Zhao ; Jun He ; Xian Huang ; Li Zhang ; Fang Yang ; Dacheng Zhang

Author_Institution

Nat. Key Lab. of Sci. & Technol. on Micro/Nano Fabrication, Peking Univ., Beijing, China

fYear

2013

fDate

3-5 June 2013

Firstpage

1

Lastpage

2

Abstract

In this work, a monolithic integrated MEMS resonator was fabricated and tested. Surface micromachining method was employed to fabricate the cantilever MEMS resonator after a standard 3 μm CMOS process. The wet release method with dilute HF solution was chosen and compared to the anhydrous HF vapor release process. A release-monitoring structure with polysilicon/Au cantilever array was used to determine the corrosion time of the sacrificial material. Results showed that the MOSFETs function well after proposed release process.

Keywords

CMOS integrated circuits; cantilevers; elemental semiconductors; gold; micromachining; micromechanical resonators; silicon; MOSFET function; Si-Au; anhydrous HF vapor release process; cantilever MEMS resonator; dilute HF solution; monolithic integrated MEMS resonator fabrication; release-monitoring structure; sacrificial material corrosion time; size 3 mum; surface micromachining method; wet-release-monitoring array method; Annealing; CMOS integrated circuits; Fabrication; monitor array; monolithic integration; wet release;

fLanguage

English

Publisher

ieee

Conference_Titel

Electron Devices and Solid-State Circuits (EDSSC), 2013 IEEE International Conference of

Conference_Location

Hong Kong

Type

conf

DOI

10.1109/EDSSC.2013.6628207

Filename

6628207