Study of EMC for Cu bonding wire application

Author

Maeda, Munenori ; Seki, Hiroshi

Author_Institution

Electron. Device Mater. Res. Lab. China, Sumitomo Bakelite (Suzhou) Co., Ltd., Suzhou, China

fYear

2013

fDate

11-14 Aug. 2013

Firstpage

393

Lastpage

395

Abstract

The influence of EMC (Epoxy Molding Compound) and reliability with fine Cu wire was studied. It is found that the failure mode was corrosion at the intermetallic layer of the wire bonding part by failure analysis after HAST (Highly Accelerated Temperature & Humidity Stress Test). Al elution and Cl ion was observed at the intermetallic layer. EMC with lower Cl ion content and Al inhibitor of corrosion shows better HAST property. The selection of flame retardant for green EMC is important because some retardant has a negative impact on HAST performance.

Keywords

aluminium alloys; chlorine; copper alloys; corrosion; failure analysis; lead bonding; life testing; moulding; reliability; Al; Cl; Cu; EMC study; HAST; copper bonding wire application; corrosion; epoxy molding compound; failure analysis; failure mode; flame retardant selection; highly accelerated temperature & humidity stress test; intermetallic layer; reliability; wire bonding; Bonding; Corrosion; Electromagnetic compatibility; Gold; Materials; Wires; Cu wire; affect of pH value toward HAST performance; inter-metaric layer between Cu and Al pad;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology (ICEPT), 2013 14th International Conference on

Conference_Location

Dalian

Type

conf

DOI

10.1109/ICEPT.2013.6756497

Filename

6756497