Title :
Study of EMC for Cu bonding wire application
Author :
Maeda, Munenori ; Seki, Hiroshi
Author_Institution :
Electron. Device Mater. Res. Lab. China, Sumitomo Bakelite (Suzhou) Co., Ltd., Suzhou, China
Abstract :
The influence of EMC (Epoxy Molding Compound) and reliability with fine Cu wire was studied. It is found that the failure mode was corrosion at the intermetallic layer of the wire bonding part by failure analysis after HAST (Highly Accelerated Temperature & Humidity Stress Test). Al elution and Cl ion was observed at the intermetallic layer. EMC with lower Cl ion content and Al inhibitor of corrosion shows better HAST property. The selection of flame retardant for green EMC is important because some retardant has a negative impact on HAST performance.
Keywords :
aluminium alloys; chlorine; copper alloys; corrosion; failure analysis; lead bonding; life testing; moulding; reliability; Al; Cl; Cu; EMC study; HAST; copper bonding wire application; corrosion; epoxy molding compound; failure analysis; failure mode; flame retardant selection; highly accelerated temperature & humidity stress test; intermetallic layer; reliability; wire bonding; Bonding; Corrosion; Electromagnetic compatibility; Gold; Materials; Wires; Cu wire; affect of pH value toward HAST performance; inter-metaric layer between Cu and Al pad;
Conference_Titel :
Electronic Packaging Technology (ICEPT), 2013 14th International Conference on
Conference_Location :
Dalian
DOI :
10.1109/ICEPT.2013.6756497
