Title :
Device for the measurement of anchor torsional strength in MEMS devices
Author :
Jun He ; Danqi Zhao ; Xian Huang ; Chen Lin ; Fang Yang ; Dacheng Zhang
Author_Institution :
Nat. Key Lab. of Sci. & Technol. on Micro/Nano Fabrication, Peking Univ., Beijing, China
Abstract :
A reliability test device for measuring the torsional strength of anchors in micro electro-mechanical system (MEMS) devices was designed and fabricated by silicon-on-glass (SOG) process. The device consists of cantilever beam, array-shaped anchor and measuring scale. Torsional fracture tests were carried out on these devices with various anchor sizes. Utilizing the test results, the correlation between torsional strength and side length of anchor was obtained by the finite element analysis (FEA). The fracture morphology also revealed that the bonding strength of array-shaped anchor is much stronger than the ultimate strength of silicon and glass.
Keywords :
anchors; beams (structures); cantilevers; finite element analysis; fracture toughness testing; glass; mechanical variables measurement; micromechanical devices; reliability; silicon; torsion; MEMS devices; Si-SiO2; anchor torsional strength measurement; array-shaped anchor; bonding strength; cantilever beam; finite element analysis; fracture morphology; measuring scale; microelectro-mechanical system; reliability test device; silicon-on-glass process; torsional fracture tests; torsional strength; ultimate strength; Laboratories; Shape measurement; TV; SOG process; array-shaped anchor; fracture test; torsional strength;
Conference_Titel :
Electron Devices and Solid-State Circuits (EDSSC), 2013 IEEE International Conference of
Conference_Location :
Hong Kong
DOI :
10.1109/EDSSC.2013.6628213
