DocumentCode
3478319
Title
High-resolution wet etching technology of thick electroless nickel alloy film for MEMS devices and packaging
Author
Zhang, Ye ; Zhu, Q.S. ; Itoh, Takayuki ; Maeda, Ryutaro ; Toda, Akira
Author_Institution
Res. Center for Ubiquitous MEMS & Micro, Eng. (UMEMSME), Nat. Inst. of Adv. Ind. Sci. & Technol. (AIST), Tsukuba, Japan
fYear
2013
fDate
11-14 Aug. 2013
Firstpage
396
Lastpage
399
Abstract
In this paper, we present a high-resolution wet etching technology of 1.5 μm-thick electroless nickel alloy film. The minimum feature size was successfully reduced to about 10 μm. The developed etching technology is well compatible to conventional micro-electro-mechanical systems (MEMS) processes, and has been successfully utilized on the 4-inch wafer as well. It could be expected more practical application of electroless nickel alloy film in not only MEMS but also electronic packaging.
Keywords
electronics packaging; etching; micromechanical devices; nickel alloys; MEMS devices; electronic packaging; high-resolution wet etching technology; micromechanical systems; size 1.5 mum; size 4 inch; thick electroless nickel alloy film; wafer; Films; Micromechanical devices; Nickel alloys; Resists; Surface treatment; electroless; micro-electro-mechanical systems; nickel; wet etching;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology (ICEPT), 2013 14th International Conference on
Conference_Location
Dalian
Type
conf
DOI
10.1109/ICEPT.2013.6756498
Filename
6756498
Link To Document