DocumentCode :
3478365
Title :
Enhanced ion implantation charging damage on thin gate oxide due to photoresist
Author :
Park, Donggun ; Hu, Chenming
Author_Institution :
Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
fYear :
1996
fDate :
16-21 Jun 1996
Firstpage :
93
Lastpage :
95
Abstract :
Charging damage during the high current ion implantation process is studied for the capacitors with 10 nm gate oxide in terms of photoresist pattern effect. Enhanced charging damage due to photoresist is studied quantitatively using antenna structures and a special photoresist pattern. Interface traps generated by the charging current injection are measured using the CV method, which is sensitive and simple to monitor the charging damage quantitatively. The oxide breakdown can be predicted from the charging voltage so determined. In-situ doped polysilicon was used for the gate electrode
Keywords :
MOS capacitors; ion implantation; photoresists; surface charging; CV measurement; MOS capacitor; antenna structure; breakdown; charging damage; current injection; high current ion implantation; in-situ doped polysilicon; interface traps; photoresist; thin gate oxide; Antenna measurements; Breakdown voltage; Capacitors; Electrodes; Ion implantation; Monitoring; Plasma applications; Plasma devices; Plasma temperature; Resists;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Ion Implantation Technology. Proceedings of the 11th International Conference on
Conference_Location :
Austin, TX
Print_ISBN :
0-7803-3289-X
Type :
conf
DOI :
10.1109/IIT.1996.586136
Filename :
586136
Link To Document :
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