Electrical simulation of 3X3 TSV array with different signal and ground patterns

In this paper, four kinds of 3X3 TSV arrays in different forms of signals and grounds were modeled and simulated using Finite Element Method. The analysis was performed by ANSYS HFSS. The target of this research is to study the influence of TSV array pattern on signal transmission characteristic and to give a guide for the design of package level interconnect using TSV arrays. The simulation results show significant differences between different cases. Signal and ground pattern can obviously affect the distribution of electromagnetic field. Based on the simulation results and analysis, this paper gave the optimized design pattern for the TSV array and some suggestions for 3D packaging design using TSVs.