Low thermal resistance design for a 2.5D package

Because of closer chip packing and thinner cross section, a 2.5 D interposer is exposed to higher thermal loads than is a 2D package, and this can lead to higher die operating temperatures. In the presence of an interposer, heat transfer can occur through the interposer itself just below the die as well the traditional path through the topside heat sink. Heat transfer simulations using ANSYS Finite Element Method (FEM) and Finite Volume Method (FVM) are used to optimize construction of a more efficient thermal package to increase thermal management options.