Unsteady-state analysis of temperature field of electronic package with power chip

Three-dimensional numerical simulation model is constructed. Temperature field of the package with power chip (3W) is analyzed under unsteady-state condition during its working process. Five convection boundary conditions are applied to analyze their influence on heat dissipation; then, three cover materials and three thickness adhesives between the cover and the chip are used to study their influence on temperature distribution. The results show that the package temperature go up faster at the beginning of the simulation time than that at ends of the simulation time, high convection significantly reduces the maximum temperature of the package, and with the improvement of thermal conductivity of the cover materials, electronic package temperature gradually reduces. In addition, adhesive thickness has impediment on heat transfer due to the package temperature slightly rises as the thickness of adhesive increases.