DocumentCode
3478699
Title
Experimental and numerical study of package moisture diffusion
Author
Xiaoqing Li ; Jianfei Long
Author_Institution
Package Dev. Team, Samsung Semicond. (China) R&D Co., Ltd., Suzhou, China
fYear
2013
fDate
11-14 Aug. 2013
Firstpage
472
Lastpage
475
Abstract
Many researches were done on the mechanism of moisture diffusion in molding compound, but there are few results on the mechanism of moisture behavior in plastic package, which is more complex than that of molding compound because of the multi-materials and interfaces in plastic package. In this study, an experimental method was developed to study the moisture invasion path and moisture distribution in plastic package. A package moisture imaging method was proposed. Nuclear Magnetic Resonance (NMR) technique and supper absorption polymer (SAP) doping were combined to gain the direct evidence of the moisture in package. Numerical simulation was performed to analyze the moisture behavior in plastic package. Based on the quantitative results of moisture distribution in package, a virtual interfacial material was introduced into numerical analysis to describe the effect of bimaterial interface on moisture diffusion behavior within a plastic package. The results show that the moisture diffusion behavior in plastic package can be predicted more exactly.
Keywords
NMR imaging; diffusion; integrated circuit packaging; moisture; numerical analysis; plastic packaging; NMR technique; bimaterial interface; moisture behavior; moisture distribution; moisture invasion path; molding compound; nuclear magnetic resonance; package moisture diffusion; package moisture imaging method; plastic package; supper absorption polymer doping; virtual interfacial material; Absorption; Compounds; Electromagnetic compatibility; Moisture; Nuclear magnetic resonance; Plastics; IC Package; Moisture diffusion; Moisture imaging; Numerical analysis;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology (ICEPT), 2013 14th International Conference on
Conference_Location
Dalian
Type
conf
DOI
10.1109/ICEPT.2013.6756515
Filename
6756515
Link To Document