The heat simulation of electronic packing for current sensor

Quadrate Flat Package (QFP) is chosen as package mode of chip for typical Hall-effect current sensors. In this paper, taking the deformation behavior of QFD structure under the temperature loading into consideration, according to related physics laws such as Fourier heat transfer law, Stephen-Boltzmann law and Newton´s law of cooling, the thermal simulation of packaging for current sensor is implemented by the finite element method (FEM). The specific implementation method is as follow: taking three power devices (one op-amp, two power tube) as the main research objects in the circuit of the current sensor. In a given model of the thermal boundary conditions (such as power consumption and heat flux), chip structure parameters and material properties, the temperature distribution and deformation of each element are simulated and their influence on the current sensor accuracy are analyzed.