Study of equivalent thermal modeling and simulation of 2.5D/3D stacked dies module

Author

Fengwei Dai ; Daquan Yu ; Jing Zhou ; He Ma ; Xiaomeng Wu ; Xiangmeng Jing ; Chongshen Song ; Hongwen He

Author_Institution

Nat. Center for Adv. Packaging, Wuxi, China

fYear

2013

fDate

11-14 Aug. 2013

Firstpage

498

Lastpage

502

Abstract

In the paper, an equivalent modeling method is proposed to simplify thermal simulation model of 2.5D stacked dies modules. A TSV and its surrounding silicon substrate or a micro bump and its surrounding underfill will be equivalent to a single body of material. Through this method, we will not only be able to obtain thermal characteristics of each part of the stacked dies module, but also can greatly simplify the calculation amount of numerical simulation. According to this method, we obtained thermal distribution map of 2.5D/3D stacked dies module; in addition, to guide and optimize thermal management design, we analyzed the influence of several parameters on maximum junction temperature of 2.5D stacked dies as well, such as spacing among dies, thermal conductivity of TIM2 (Thermal Interface Material), ambient temperature, wind speed and so on. It was found that with the increase in spacing among dies, the maximum junction temperature of dies decreases and the maximum decreasing amplitude is 4.4°C. Secondly, impact on the maximum junction temperature of die, the ambient temperature of the cabinet is the most serious. Finally, the wind speed of the cabinet and the thermal conductivity of TIM2 (Thermal Interface Material) also have a great effect on the maximum junction temperature of die.

Keywords

integrated circuit packaging; modules; numerical analysis; thermal conductivity; thermal management (packaging); three-dimensional integrated circuits; 2.5D stacked dies module simulation; 3D stacked dies module simulation; TIM2; TSV; ambient temperature; equivalent thermal modeling method; maximum junction temperature; microbump; numerical simulation; silicon substrate; thermal conductivity; thermal distribution map; thermal interface material; thermal management design; thermal simulation model; wind speed; Conductivity; Heating; Junctions; Silicon; Thermal conductivity; Through-silicon vias; 2.5D stacked dies module; TSV; equivalent modeling method; thermal distribution map;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology (ICEPT), 2013 14th International Conference on

Conference_Location

Dalian

Type

conf

DOI

10.1109/ICEPT.2013.6756520

Filename

6756520