Title :
Crosstalk analysis of interconnection structures fabricated on silicon interposer
Author :
He Yi ; Liqiang Cao ; Jing Zhou ; Qibing Wang ; Daquan Yu ; Lixi Wan
Author_Institution :
Inst. of Microelectron., Beijing, China
Abstract :
Over the last decade, due to requirements of high speed performance and small form factor, signal integrity becomes a significant portion of package design effort. Especially, crosstalk analysis among interconnects in high density and fine pitch packages has become critical for optimized design of signal interconnects. This paper discusses crosstalk analysis among interconnection structures fabricated on silicon interposer. Two kinds of structures are considered. One is the transmission lines fabricated on redistribution layers; the other is TSV (through silicon via) arrays. Through crosstalk analysis, we roughly evaluated the coupling property of some specified interconnection structures and proposed several optimized structures to reduce crosstalk.
Keywords :
crosstalk; elemental semiconductors; fine-pitch technology; integrated circuit packaging; silicon; three-dimensional integrated circuits; transmission lines; crosstalk analysis; fine pitch packages; high density packages; interconnection structures; package design effort; redistribution layers; signal integrity; signal interconnects; silicon interposer; through silicon via arrays; transmission lines; Analytical models; Crosstalk; Integrated circuit interconnections; Microstrip; Power transmission lines; Silicon; Through-silicon vias; TSV; crosstalk; silicon interposer; transmission lines;
Conference_Titel :
Electronic Packaging Technology (ICEPT), 2013 14th International Conference on
Conference_Location :
Dalian
DOI :
10.1109/ICEPT.2013.6756531