Title :
Corrosion Measurement of a Conductive Paste and Anisotropic Conductive Adhesive Films
Author :
Ikeda, Osamu ; Watanabe, Yoshio ; Itoh, Fuminari
Author_Institution :
Sony Corporation, Tokyo
fDate :
Jan. 16 2007-Yearly 18 2007
Abstract :
We measured corrosion layer thickness on a conductive paste (CP-Ag) and anisotropic conductive adhesive films (ACFs). CP-Ag consist of epoxy resin and silver powder, and ACFs consist of epoxy resin and about 4 mum in diameter of uniform plastics particles with Ni and Au/Ni plating. Firstly the conductive paste was printed on the polyimide film, and ACFs were bonded on the glass with indium-tin-oxide (ITO) electrodes. After thermal curing, these samples were set in the condition of an acceleration corrosion test; 2 ppm of H2S gas, 4 ppm of NO2 gas, 30degC, 70%RH. After exposure in corrosive gases for 77.3 hours, these samples were cut to analyze the resultant corrosion, using the SAICAS (surface and interfacial cutting analysis system) slant-cut method. The sulfur component in the cut section of each sample was measured by using both the scanning electron microscope (SEM) and the energy dispersive X-ray microanalysis (EDX) component analysis method. As a result, we found that the corrosion reached a depth of about 2 mum on CP-Ag. This depth is our predictive value. But on ACFs, the sulfur component was not found. Then ACFs were set in the condition of other acceleration corrosion test; 0.07 ppm of H2S gas, 1.4 ppm of NO2 gas, 1.4 ppm of SO2 gas, 0.07 ppm of Cl2gas, 35degC, 85%RH for 96 hours. The affection of corrosive gases reached in the depth of about 1.2 mum when we paid the attention about the weight ratio for oxygen and nickel.
Keywords :
X-ray chemical analysis; conductive adhesives; corrosion; polymer films; scanning electron microscopes; SEM; anisotropic conductive adhesive films; conductive paste; corrosion layer thickness; energy dispersive X-ray microanalysis; epoxy resin; indium-tin-oxide electrodes; polyimide film; scanning electron microscope; silver powder; slant-cut method; surface-interfacial cutting analysis system; thermal curing; uniform plastics particles; Anisotropic conductive films; Anisotropic magnetoresistance; Conductive adhesives; Conductivity measurement; Corrosion; Epoxy resins; Gases; Life estimation; Nickel; Testing; anisotropic conductive adhesive film; conductive paste; corosion; sulfur component;
Conference_Titel :
Polymers and Adhesives in Microelectronics and Photonics, 2007. Polytronic 2007. 6th International Conference on
Conference_Location :
Odaiba, Tokyo
Print_ISBN :
978-1-4244-1186-3
Electronic_ISBN :
978-1-4244-1186-3
DOI :
10.1109/POLYTR.2007.4339142