DocumentCode :
3479200
Title :
Hygro-thermo-mechanical modeling of LED Luminaires
Author :
Pinghua Zeng ; Daoguo Yang ; Hongyu Tang ; Miao Cai
Author_Institution :
Sch. of Mech. & Electr. Eng., Guilin Univ. of Electron. Technol., Guilin, China
fYear :
2013
fDate :
11-14 Aug. 2013
Firstpage :
606
Lastpage :
611
Abstract :
The purpose of this work is to conduct the multi-physics simulation analysis of LED luminaire under certain temperature and humidity environment, and to find out the vulnerable spot of the LED luminaire. The coupled modeling of LED luminaire under the temperature and humidity conditions is simulated by ANSYS. Five types of modeling, i.e. thermal and thermo-mechanical modeling, moisture diffusion and hygro-mechanical modeling, and thermo-mechanical-moisture modeling. The Coupled stress of the LED luminaire at 85 °C and 85% relative humidity is performed by multi-physics approach which using finite element method combined with additional user subroutines. Then, the effect of thermal expansion, hygroscopic swelling and delamination in the luminaire is predicted. Finally, the failure modes of LED luminaire, which is concluded from the LED luminaire SSAT experiment, is compared and discussed with the crucial locations of LED luminaire in FEM simulation. It is shown that the simulation results agree with vulnerable spot well from the test, which indicates that the multi-physics approach can be used for simulating the condition of LED luminaire in real and predicting the failure modes.
Keywords :
delamination; finite element analysis; light emitting diodes; moisture; thermal expansion; ANSYS; LED luminaire; delamination; finite element method; humidity condition; hygro-thermo-mechanical modeling; hygroscopic swelling; moisture diffusion modeling; multiphysics simulation analysis; temperature 85 C; temperature condition; thermal expansion; thermo-mechanical-moisture modeling; Electronic packaging thermal management; Finite element analysis; Light emitting diodes; Moisture; Stress; Thermal stresses; Thermomechanical processes; ANSYS finite element; Heat; LED luminaire; moisture; stress;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Packaging Technology (ICEPT), 2013 14th International Conference on
Conference_Location :
Dalian
Type :
conf
DOI :
10.1109/ICEPT.2013.6756543
Filename :
6756543
Link To Document :
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