DocumentCode
3479212
Title
Dose and damage control of MeV-implants by photothermal heterodyne analysis
Author
Brand, K. ; Karge, H. ; Geiler, H.D.
Author_Institution
Ruhr-Univ., Bochum, Germany
fYear
1996
fDate
16-21 Jun 1996
Firstpage
218
Lastpage
221
Abstract
High energy ion implantation in silicon is used to create different damage profiles in depths up to 25 μm. In order to control the irradiation parameters a fast nondestructive evaluation of the created radiation damage is realized by the photothermal heterodyne technique. A 5.4 MeV-He-implant in comparison with that of a 5.4 MeV-Si-implant is investigated, The dose is evaluated over a wide range from 5×109 cm-2 up to 1014 cm-2. The sweep of the modulation frequency allows one to probe the radiation damage in different depths corresponding to the penetration depth of the excess carrier wave. Possibilities and limits of the depth profiling by the frequency dependent response analysis are demonstrated and discussed
Keywords
elemental semiconductors; helium; ion implantation; nondestructive testing; photothermal effects; production testing; silicon; 5.4 MeV; Si:He; Si:Si; damage control; damage profiles; dose control; excess carrier wave; frequency dependent response analysis; high energy ion implantation; irradiation parameters; modulation frequency; nondestructive evaluation; penetration depth; photothermal heterodyne analysis; radiation damage; Electromagnetic measurements; Electromagnetic scattering; Frequency measurement; Frequency modulation; Ion implantation; Optical mixing; Optical modulation; Optical sensors; Reflectivity; Silicon;
fLanguage
English
Publisher
ieee
Conference_Titel
Ion Implantation Technology. Proceedings of the 11th International Conference on
Conference_Location
Austin, TX
Print_ISBN
0-7803-3289-X
Type
conf
DOI
10.1109/IIT.1996.586189
Filename
586189
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