Title :
Relationship between SSN and EMC in SiP
Author :
Wang Shenglong ; Sun Ling ; Sun Haiyan ; Yang Lingling ; Zhu Boyuan ; Lu Junwei
Author_Institution :
Jiangsu Key Lab. of ASIC Design, Nantong Univ., Nantong, China
Abstract :
An investigation of simultaneous switching noise (SSN) and electromagnetic compatibility (EMC) issues in a physical model of a system in package (SiP) is presented in this paper. SSN simulation is conducted in time domain with an extracted package model which contains package components, drivers and terminal resistors. In addition, electromagnetic interference (EMI) from the SiP is observed from far field and near field. Far-field simulation is performed in a simulated microwave anechoic chamber environment and near-field result is obtained by a near-field scan simulation. The simulation results show that by increasing number of drivers in SiP package will directly level up SSN which is acting as a major source of EMI. Therefore, capacitor placement in the SiP package is proposed for the purpose of SSN suppression and EMI reduction.
Keywords :
anechoic chambers (electromagnetic); electromagnetic compatibility; electromagnetic interference; integrated circuit modelling; integrated circuit noise; system-in-package; time-domain analysis; EMC; EMI reduction; SSN simulation; SSN suppression; SiP; capacitor placement; electromagnetic compatibility; electromagnetic interference; extracted package model; far-field simulation; microwave anechoic chamber environment; near-field scan simulation; package components; simultaneous switching noise; system in package; terminal resistors; time domain; Capacitors; Electromagnetic compatibility; Electromagnetic interference; Integrated circuit modeling; Noise; Switches; Decoupling Capacitor; EMC; SSN; SiP;
Conference_Titel :
Electronic Packaging Technology (ICEPT), 2013 14th International Conference on
Conference_Location :
Dalian
DOI :
10.1109/ICEPT.2013.6756546
