Microstructure and conductivity analysis of silver-based conductive adhesive by TEM with double-probe piezodriving holder

Author

Kawamoto, N. ; Murakami, Y. ; Shindo, D. ; Suganuma, K.

Author_Institution

Tohoku Univ., Sendai

fYear

2007

fDate

Jan. 16 2007-Yearly 18 2007

Firstpage

101

Lastpage

104

Abstract

Microstructure of Ag-epoxy conductive adhesive, which is expected as a substitution for Pb-free solder, has been investigated by electron microscopy. The observations have demonstrated the presence of agglomerations of Ag particles, and they are likely to be connected to form huge conduction paths in a solidified state. Moreover, multidisciplinary tests (e.g., simultaneous examination of the microstructure and electric resistivity) on the solidified adhesives were performed inside the transmission electron microscope with the aid of mobile microprobes.

Keywords

adhesives; crystal microstructure; electrical conductivity; silver; solders; transmission electron microscopy; TEM; conduction paths; conductivity analysis; double-probe piezodriving holder; electron microscopy; mobile microprobes; silver-based conductive adhesive; solidified adhesives; transmission electron microscope; Conducting materials; Conductive adhesives; Conductivity; Electron emission; Electron microscopy; Electron mobility; Microstructure; Scanning electron microscopy; Testing; Transmission electron microscopy; Transmission electron microscopy; conductive adhesive; electronic packaging; microprobe, fine particle;

fLanguage

English

Publisher

ieee

Conference_Titel

Polymers and Adhesives in Microelectronics and Photonics, 2007. Polytronic 2007. 6th International Conference on

Conference_Location

Odaiba, Tokyo

Print_ISBN

978-1-4244-1186-3

Electronic_ISBN

978-1-4244-1186-3

Type

conf

DOI

10.1109/POLYTR.2007.4339147

Filename

4339147