Title :
Microstructure and conductivity analysis of silver-based conductive adhesive by TEM with double-probe piezodriving holder
Author :
Kawamoto, N. ; Murakami, Y. ; Shindo, D. ; Suganuma, K.
Author_Institution :
Tohoku Univ., Sendai
fDate :
Jan. 16 2007-Yearly 18 2007
Abstract :
Microstructure of Ag-epoxy conductive adhesive, which is expected as a substitution for Pb-free solder, has been investigated by electron microscopy. The observations have demonstrated the presence of agglomerations of Ag particles, and they are likely to be connected to form huge conduction paths in a solidified state. Moreover, multidisciplinary tests (e.g., simultaneous examination of the microstructure and electric resistivity) on the solidified adhesives were performed inside the transmission electron microscope with the aid of mobile microprobes.
Keywords :
adhesives; crystal microstructure; electrical conductivity; silver; solders; transmission electron microscopy; TEM; conduction paths; conductivity analysis; double-probe piezodriving holder; electron microscopy; mobile microprobes; silver-based conductive adhesive; solidified adhesives; transmission electron microscope; Conducting materials; Conductive adhesives; Conductivity; Electron emission; Electron microscopy; Electron mobility; Microstructure; Scanning electron microscopy; Testing; Transmission electron microscopy; Transmission electron microscopy; conductive adhesive; electronic packaging; microprobe, fine particle;
Conference_Titel :
Polymers and Adhesives in Microelectronics and Photonics, 2007. Polytronic 2007. 6th International Conference on
Conference_Location :
Odaiba, Tokyo
Print_ISBN :
978-1-4244-1186-3
Electronic_ISBN :
978-1-4244-1186-3
DOI :
10.1109/POLYTR.2007.4339147
